WebFeb 10, 2024 · Great Team Backend Foundry is part of the Minerals & Mining industry, and located in China. Great Team Backend Foundry Location B Gbm Park Yue Yuen Industrial Estate Huang Jiang Zhen, Dongguan, Beijing,China Description Industry Metals & Mining General Metals & Mining Discover more about Great Team Backend Foundry WebGreat Team Backend Foundry (杰群电子科技(东莞), GTBF) is a provider of semiconductor component packaging and testing solutions. It offers wafer grinding, final … Lingsen has 1 employees across 2 locations and NT$7.73 b in annual … Great Team Backend Foundry's main competitors include Shenzhen Diantong … Great Team Backend Foundry. Overview; Locations; Financials; Operating … Great Team Backend Foundry financials. Header placeholder lorem ipsum dolor …
Great Team Backend Foundry headquarters and office locations
WebCompany Introduction Great Team Backend Foundry is located in taiwan. Contact Information Contact Person Telephone 886-886-2- 8226-3984 Fax Number Website http://www.gtbf-ltd.com Post Code Address, Taiwan Online Map Great Team Backend Foundry Map & Directions WebJanet Sun works at Great Team Backend Foundry, which is an Electronics company with an estimated 12 employees. Janet is currently based in Dongguan , Guangdong. Found email listings include: j***@gtbf-ltd.com. Read More . Contact. Janet Sun's Phone Number and Email Last Update. 2/4/2024 2:34 PM. Email. duty free in france
Great Team Backend Foundry: Employee Directory - ZoomInfo
Web2) Great Team Backend Foundry, Inc., China 3 Label ( COD ) Israel = “Tower Semiconductor Ltd. “ production No Change 4 Label ( COA ) Mexico = "Tijuana" production 1) Mexico = "Tijuana" production 2) China = Great Team Backend Foundry, Inc.production 5 Marking TIJ marks "P" (Lead Free indicator) on line#2 4th character GTBF WebAug 2, 2024 · Great Team Backend Foundry (HK) Limited. Great Team Backend Foundry (HK) Limited (杰群科技有限公司) was incorporated on 02-AUG-2024 as a private company limited by shares type, The date of annual examination for this private company limited is between Aug 02 and Sep 12 upon the anniversary of incorporation. The … WebAssignee: Great Team Backend Foundry Inc. Inventor: Chung Hsing Tzu High heat-dissipation chip package structure. Patent number: 9472493 Abstract: A high heat-dissipation chip package structure for packaging the semiconductor chips is disclosed. A pre-attachment film is adhered on an upper surface of a heat-dissipation plate or a … crystal mccallum polyphia